Flexible Hybrid Electronics
ACI materials provide excellent adhesion, flexibility, and low processing temperatures that are critical to the performance of FHE systems.
Our Flexible Hybrid Electronics Materials
Our conductive trace can bend sharply with minimal conductivity change and exhibits excellent adhesion to PET and polyimides.
ACI’s UV and Thermally Cured inks have excellent adhesion to PET and polyimide films, and can be creased without cracking or delamination.
Our conductive adhesives offer superior adhesion to flexible substrates, good conductivity, and can be cured at temperatures as low as 80°C.
Flexible Hybrid Electronics Anatomy
ACI offers a fully compatible materials system for FHE applications including Conductive Inks, Conductive Adhesives, Encapsulants and Crossover Dielectrics. All these materials demonstrate superior adhesion to PET and polyimide films, and can be cured at low temperatures to accommodate sensitive components and substrates.
Flexible Conductive Trace
The excellent dispersion created by cavitation enables our conductive trace to bend and flex with minimal change in resistivity. FE3124 offers excellent rheology and superior adhesion to PET and polyimide films. The ink is screen printable and can be cured as low as 80°C.
ACI offers UV and Thermally Cured encapsulant materials, FE5113 and FE5227, both with outstanding adhesion to flexible substrates and ACI’s conductive trace. These materials also serve as crossover dielectrics and can be bent without delamination or cracking. These non-conductive inks are screen printable and FE5227 cures down to 80°C.
Multiple Adhesive Solutions
FE1101 is a silver filled epoxy which remains flexible after cure to minimize stresses due to bending. The material has great adhesion to PET and polyimide films, and cures at temperatures below 80°C. FE1201 has truly superior adhesion to flexible substrates and enables “hollow” bonding pads for thrifted designs.
Putting it All Together
New and emerging products in both consumer and industrial electronics industries require more organic and functional shapes than are obtainable with standard rigid circuit boards. Older technology is thus giving way to materials architectures that can bend, flex, and conform to more useable form factors. Newer combinations of thin silicon components and flexible conductors printed on plastic substrates offer a better packaging solution, and are often referred to as Flexible Hybrid Electronics*. Typical flexible substrate materials include PET and polyimide films, and the printed conductive traces and dielectric materials (also called encapsulants) must conform to new shapes without changing properties. New conductive adhesives are also available that bond well with the substrate materials and offer mechanical compliance to accommodate bending. The integration of these materials, along with an example of the level of flexibility required, is shown in the figure.
*Stretchable materials systems, while often referred to as hybrid electronics, require different functionality are offered as a dedicated materials set by ACI.
Download Our Conductive
Trace Data Sheet – FE3124
Bend and flex without changing conductivity.
Download Our Flexible Conductive
Adhesive Data Sheet – FE1101
Remains flexible to minimize forces that lead to delamination.
Download Our Conductive
Adhesive Data Sheet – FE1201
Bond strong enough to tear PET.
Download Our UV Curable
Encapsulant Data Sheet – FE5113
Cure quickly and maintain flexibility and compatibility.
Download Our Thermally Cured
Encapsulant Data Sheet – FE5227
Cure at low temperatures to protect sensitive components.