TM1079 is a silver filled, solvent free, one component die attach adhesive that can undergo strains of up to 50% post cure. This conductive adhesive was designed for large dies and accommodates thermomechanical stresses arising from differences in the thermal expansion coefficients between components. TM1079 is highly thermally conductive and can be used in a broad range of applications including aerospace, defense, lighting, energy and medical electronics.
TM1079 is compatible with large die, and applications with high CTE mismatch. It can be used with high volume automated dispensing processes. The cured material displays outstanding thermal and electrical conductivity, with a unique combination of high flexibility, high die shear strength after significant thermal cycling, and high adhesion to a broad range of materials. The cured material provides stress relief for bonding dissimilar materials which enables high reliability performance metrics such as high resistance to shock and cyclic fatigue.