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Product Description

FE1101 is a one-part conductive adhesive for temperature sensitive applications, flexible/stretchable substrates, or those applications requiring bond-line flexibility. This epoxy-based adhesive is silver filled and demonstrates superior adhesion to untreated PET, polymide and thermoplastic urethanes. The low cure temperature of 70° C minimizes problem with low residual shrinkage polymer films and/or tight registration tolerance applications. The adhesive maintains flexibility when fully cured, minimizing the stress concentrations that can lead to substrate, component, and interfacial failure.


Product Benefits

  • Low cure temperature (70°C) good for temperature sensitive materials and components.
  • Excellent adhesion to PET, polymide, and TPU.
  • Maintains flexibility to reduces stress and minimize substrate damage during use.
  • Superior adhesion to aluminum, bonds well to copper and noble metal plated contacts.
  • Adhesive can be exposed to wash cycles for typical bond line thickness.
  • Fully compatible with ACI's stretchable and flexible and encapsulants.

Available Sizes


Custom fills are available.

Please contact ACI.


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FE1101

Flexible Conductive Adhesive

Low temp cure with long pot life.