Flexible Hybrid Electronics

Flexible Hybrid Electronics Anatomy

Full Solution
ACI offers a fully compatible materials system for FHE applications including Conductive Inks, Conductive Adhesives, Encapsulants and Crossover Dielectrics. All these materials demonstrate superior adhesion to PET and polyimide films, and can be cured at low temperatures to accommodate sensitive components and substrates.

Putting it All Together
New and emerging products in both consumer and industrial electronics industries require more organic and functional shapes than are obtainable with standard rigid circuit boards. Older technology is thus giving way to materials architectures that can bend, flex, and conform to more useable form factors. Newer combinations of thin silicon components and flexible conductors printed on plastic substrates offer a better packaging solution, and are often referred to as Flexible Hybrid Electronics*. Typical flexible substrate materials include PET and polyimide films, and the printed conductive traces and dielectric materials (also called encapsulants) must conform to new shapes without changing properties. New conductive adhesives are also available that bond well with the substrate materials and offer mechanical compliance to accommodate bending. The integration of these materials, along with an example of the level of flexibility required, is shown in the figure.

*Stretchable materials systems, while often referred to as hybrid electronics, require different functionality are offered as a dedicated materials set by ACI.

Our Flexible Hybrid Electronics Materials