TS1334 is a stretchable adhesive with superior electrical conductivity. It is a silver filled, one component epoxy that can be deposited using stencil, syringe, or jet dispensing. The adhesive was designed for bonding components to compliant substrates and remains stretchable following thermal cure. This highly compliant material lowers the stress risers at the bonded interface and accommodates bending and flexing in a variety of applications.
TS1334 is compatible with flexible and stretchable systems where high electrical conductivity is required. This stretchable conductive adhesive accommodates bending and stretching along the bond line and improves interconnect robustness and reliability. TS1334 can be deposited via stencil, syringe, or jet dispensing and cures with low shrinkage. The combination of high electrical conductivity, high shear strength, and high adhesion to a broad range of materials makes it a good choice for bonding in many flexible and stretchable applications. It is also appropriate for bonding rigid components in packages with large thermally induced strains.