Alchemy Ink Technology

ACI Alchemy Conductive Inks are changing the game for additive manufacturing of flexible electronics.

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ACI Alchemy Ink Technology

PERCOLATION

Percolation-1A

Wet as Printed

Percolation-2A

After Drying

Percolation-3A

Result

Polymer and “lubricants” from flaking create contact “resistance”. Resin at substrate interface provides adhesion.

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SINTERING

Sinterabe-1A

Wet as Printed

Sinterable-2A

After Drying

Sinterable-3A

Result

Sintering yields no contact resistance. Difficult to get resin to substrate without hurting resistivity.

SEMI-SINTERING

Semi-Sinterable-1A

Wet as Printed

Semi-Sinterable-2A

After Drying

Semi-Sinterable-3A

Result

Some sintering between particles and high aspect flakes. Higher resin content than pure nano sintering materials yield superior adhesion.

ACI Alchemy Conductive Inks

ACI Materials has developed a new series of semi sinterable and sinterable conductive inks which demonstrate a unique combination of capabilities
  • Lower sheet resistance than PTF, nanoparticle, and metal complex based inks
  • Faster cure times than traditional nanoparticle based sinterable inks
  • Nano like volume resistivity (conductivity), but in less time
  • Superior hard crease survivability compared to even PTF inks
  • Allow high resolution printing without compromising resistivity and sheet resistance
  • Enables reflow soldering using solder pastes
  • Thinner EMI shielding coatings

FS0117

Semi-Sintering Conductive Ink

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FS0142

Semi-Sintering Conductive Ink

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